1/5/2023 0 Comments Metal grids![]() ![]() This method could provide flexible metal grid TCs with the high aspect ratio, showing R s < 1 Ω sq −1 at T 550nm = 91%. 28 showed the metal grid structures that are embedded and mechanically anchored onto a flexible substrate using electroplating process. The SG metal grid TCs exhibited R s of 8 Ω sq −1 at T 550nm of 91% and a reasonable electromechanical stability under bending stresses. 27 suggested a method for directly generating the SG metal grid TCs on polyethylene terephthalate (PET) substrates, which were coated using a poly(dopamine) to improve interfacial adhesion between the SG metal NPs and the substrate. After rapid thermal annealing, the SG metal grid TCs showed superior optoelectrical properties than those obtained using vacuum-based metal deposition: sheet resistance ( R s) of 3.5 Ω sq −1 vs 10.7 Ω sq −1 at transmittance ( T 550nm) of 76%, respectively. 26 introduced the SG metal grid TCs generated using electroless plating and soft lithography on a glass substrate. Recently, solution-grown (SG) metal grid TCs fabricated using electroless plating or electroplating have been reported to show excellent optoelectrical properties. Especially, these issues hindered the use of large-scale TCs. Metal grids crack#The unsintered metal grid structures with non-uniform shape and thickness (> μm) suffered from a local damage or a crack generation, resulting in locally unstable mechanical, electrical and optical properties during the mold detachment. 16 carried out experiments on temperature-controlled direct imprinting of silver ionic ink, enhancing the optoelectrical properties of metal grid TCs by the porosity reduction. They exhibited the poor electrical conductivity compared with the evaporative metal grids obtained using photo-roll lithography 21– 23 due to random loose packings of NPs, incomplete elimination of organic complexes and the existence of many pores between NPs 24, 25. The solution-processed metal grid TCs show the electrical conductivity from merging of neighboring NPs and eliminating of insulating organic complexes by several sintering processes, including thermal sintering 17, photonic sintering 18, laser sintering 19 and chemical sintering 20. Especially, the metal grid TCs are typically fabricated using a variety of printing technologies of metal nanoparticles (NPs), including inkjet printing 11, gravure printing 12, micro-contact printing 13 and direct imprinting 14– 16 at low costs and in a high throughput manner. ![]() Among these nanomaterial-based TCs, the metal grid TCs have been spotlighted for use in flexible optoelectronic devices due to facile control over their grid width and spacing, scalability to large-area application, uniform sheet resistance and low junction resistance 8– 11. Recently, there have been increasing efforts in developing alternative nanomaterial TCs based on carbon nanotubes 4, graphene 5, metal nanowires 6 and metal grids 7 to replace indium tin oxide (ITO)-based films. Transparent conductors (TCs) are essential components for a variety of optoelectronic devices, including organic solar cells 1, organic light-emitting diodes (OLEDs) 2, touch screen panels 3. ![]() Our approach can open a new route to enhance the functionality of metallic structures fabricated using a variety of solution-processed metal patterning methods for next-generation optoelectronic and micro/nanoelectronic applications. Finally, organic light-emitting diodes based on the flexible metal grid transparent conductors are demonstrated. Also, it reinforces the electromechanical stability of flexible metal grid transparent conductors against a small bending radius or a repeated loading. The selective multi-nanosoldering leads to lowering the sheet resistance of the metal grid transparent conductors, while keeping the optical transmittance constant. Here we introduce a selective multi-nanosoldering method to generate robust metallic layers on the thin metal grid structures (< a thickness of 200 nm), which are generated via self-pining assisted direct inking of silver ions. However, there are still remaining challenges to improve optoelectrical properties and electromechanical stability of the metallic structures due to random loose packings of nanoparticles and the existence of many pores. Solution-processed metal grid transparent conductors with low sheet resistance, high optical transmittance and good mechanical flexibility have great potential for use in flexible optoelectronic devices. ![]()
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